封装形式 http://www.cpu-collection.de/?tn=0&l0=package
Dip
PDIP (Plastic Dual In-Line Package)
CDIP / CERDIP (Ceramic Dual In-Line Package)
![](http://www.cpu-collection.de/images/package/DIPscheme_1.gif)
QFP
PQFP (Plastic Quad Flat Package)
CQFP (Ceramic Quad Flat Package)
TQFP (Thin Quad Flat Package)
![](http://www.cpu-collection.de/images/package/QFPscheme_1.gif)
PLCC(Plastic Leaded Chip Carrier)
CLCC (Ceramic Leaded Chip Carrier) |
![](http://www.cpu-collection.de/images/blank.gif) |
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![](http://www.cpu-collection.de/images/package/PLCCscheme_1.gif)
LCC
(Leadless Chip Carrier)
![](http://www.cpu-collection.de/images/package/LCCscheme_1.gif)
PGA
PPGA (Plastic Pin Grid Array)
CPGA (Ceramic Pin Grid Array)
SPGA (Staggered Pin Grid Array)
OPGA (Organic Pin Grid Array)
FC-PGA (Flip Chip Pin Grid Array)
FC-PGA 2 (Flip Chip Pin Grid Array with Heat Spreader)
![](http://www.cpu-collection.de/images/package/PGAscheme_1.gif)
Slot Packages
SECC (Single Edge Contact Cartridge)
SECC 2 (Single Edge Contact Cartridge, Type 2)
SEPP (Single Edge Processor Package)
[此贴子已经被作者于2005-5-28 11:58:43编辑过] |